Global Hermetic Packaging Market Size, Trends & Analysis with Covid-19 Impact - Forecasts to 2026 By Configuration (Multilayer Ceramic Packages, Pressed Ceramic Packages, Metal Can Packages), By Application (Transistors, Sensors, Lasers, Airbag Ignitors, Photodiodes, Oscillating Crystals, MEMS Switches, Others), By Type (Ceramic-Metal (CERTM) Sealing, Glass-Metal Sealing (GTMS), Transponder Glass, Reed Glass, Passivation Glass), By Industry (Military & Defense, Aeronautics & Space, Automotive, Energy & Nuclear Safety, Medical, Telecommunications, Consumer Electronics, Others), By Region (North America, Europe, Asia Pacific and Rest of the World); and Company Market Share Analysis & Competitor Analysis
Hermetic Packaging Market: Insights
The global demand for hermetic packaging is expected to experience a substantial CAGR over the coming years (2020-2026). Hermetic packaging is a state-of-the-art packaging technique that has main uses in passive and active electronic products and is also used in the semiconductor and electronics industries. Hermetic packaging is any type of packaging that allows an airtight product that prevents air, oxygen, and other gases from going through. Increased use of hermetic packaging to secure extremely sensitive electronic components and increased demand from various industries, including automotive and aerospace, is propelling the market growth during the forecast period. Hermetic packaging is essential if different health and electronic devices are to work safely and correctly. Moreover, increasing research and advancements in the defense sector is one of the main drivers driving market growth. However, the fluctuation in prices of raw materials and stringent rules and regulations by the government are some of the factors hampering the market growth.
Hermetic Packaging Market: By Configuration
Given by configuration, the global hermetic packaging market is segregated into a metal can packages, pressed ceramic packages, and multilayer ceramic packages among others. The multilayer ceramic packages will witness the highest penetration rate over the forecast period. This is due to the increasing adoption of the military and defense industry, which are some of the factors driving the growth of the sector. Multilayer ceramic packages are ideally suited for packing complex electronic circuits, for example, microelectromechanical systems (MEMS). The ability of ceramic multilayer kits to provide improved hermeticity compared to other designs for high-frequency applications such as data transmission, wireless communication, and optical communication is one of the significant factors expected to propel the market.
Hermetic Packaging Market: By Type
Given by the type, the global hermetic packaging market is bifurcated into reed glass, ceramic-metal sealing (CERTM), transponder glass, glass-metal sealing (GTMS), and passivation glass. Among the types, the ceramic-metal sealing segment will propel at a high growth rate over the forecast period. This is due to the high resistance to corrosion and the increasing use in the healthcare industry. It is a microelectronic package that allows data transmission at high speed with a minimal footprint. Furthermore, the reed glass segment has accounted for the largest market share during the forecast period due to the rising use of reed glass in seat belt & brake fluid control in the electrical & electronics home appliances and automobile sector are some of the factors driving the market growth.
Hermetic Packaging Market: By Application
Based on the application, this market is segmented into transistors, oscillating crystals, airbag ignitors, photodiodes, sensors, lasers, and MEMS switches, among others. The transistors segment is projected to hold the largest market share during the forecast period due to increased demand for hermetically packaged transistors for telecommunication devices is one of the significant factors expected to drive the market growth.
Hermetic Packaging Market: By Industry
The global hermetic packaging market is segmented into aeronautics & space, military & defense, energy & nuclear safety, automotive, medical, telecommunications, and consumer electronics, among others based on industry. The military & defense segment will witness a high penetration rate over the coming years. This is due to the increasing investment in the defense sector and an increase in demand for high-quality hermetic packaged electronic components are some of the key factors expected to propel the market growth. Moreover, security threats and fluctuating crude oil prices are propelling segment growth.
Hermetic Packaging Market: By Region
North America is expected to hold the largest market share during the forecast period due to the high R&D testing involved in the military & defense application, and focusing on repair and maintenance of the aircraft. Moreover, The U.S. defense sector is projected to expand substantially due to new policies implemented to improve the country's military services is one of the significant factors expected to propel the growth. Furthermore, the Asia-Pacific region is projected to grow at a high CAGR during the forecast period due to the utilization of new technologies to improve public safety and the expansion of the consumer electronics industry in countries such as China, Japan, and India - are some of the major factors driving the market growth.
Hermetic Packaging Market Share & Competitor Analysis
Some of the key players operating in the hermetic packaging market include Egide, Legacy Technologies Inc., Coat-X, Hermetics Solutions Group, Willow Technologies, Renesas Electronics Corporation, SGA Technologies, Complete Hermetics, Special Hermetic Products Inc., SCHOTT, AMETEK, Inc., Amkor Technology, Inc., StratEdge, Mackin Technologies, Palomar Technologies, CeramTec, Bel Fuse, Inc., ITT Inc, Rosenberger, and Aptiv PLC - Winchester Interconnect, Teledyne Technologies, Texas Instruments Incorporated, Materion Corporation, Kyocera Corporation among others.
Please note: This is not an exhaustive list of companies profiled in the report.
In August 2019, KYOCERA Corporation established its new research center, Minato Mirai, in Yokohama, Japan. The Center was set up to promote collaboration and the advancement of innovative business and technology.
In June 2019, SCHOTT introduced new SCHOTT HEATAN feed through the product to extend its portfolio of hermetic sensor packaging.
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The global Hermetic Packaging Market has been studied from the year 2017 till 2026. However, the CAGR provided in the report is from the year 2018 to 2026. The research methodology involved three stages: Desk research, Primary research, and Analysis & Output from the entire research process.
The desk research involved a robust background study which meant referring to paid and unpaid databases to understand the market dynamics; mapping contracts from press releases; identifying the key players in the market, studying their product portfolio, competition level, annual reports/SEC filings & investor presentations; and learning the demand and supply side analysis for the Hermetic Packaging Market.
The primary research activity included telephonic conversations with more than 50 tier 1 industry consultants, distributors, and end-use product manufacturers.
Finally, based on the above thorough research process, an in-depth analysis was carried out considering the following aspects: market attractiveness, current & future market trends, market share analysis, SWOT analysis of the companies and customer analytics.
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