Photonic Integrated Circuits [PIC] Market Size, Trends & Analysis - Forecasts to 2026 By Integration Type (Monolithic Integration, Hybrid Integration, and Module Integration), By Raw Material (Indium Phosphide, Gallium Arsenide, Lithium Niobate, Silicon, Silicon-on-Insulator, and Others)By Component (Lasers, Modulators, Detectors, Attenuators, Multiplexers /De-multiplexers, and Optical Amplifiers) By Application (Optical Communication, Sensing, Optical Signal Processing, and Biophotonics), By Region (North America, Europe, Asia Pacific and Rest of the World); Landscape, Company Market Share Analysis, and Competitor Analysis
PIC is a coordinated circuit that uses photons for the exchange of data signals in the obvious or close to an infrared range of light. Photonic Integrated Circuits technology is used for the transmission of huge dataquickly. These circuits are majorly deployed in optical field communication sectors, to transfer data. Even though like electronic integrated circuits the PICutilizes optical frequencies. The PICs offer additional advantages of more prominent speed, improved functionalities, and higher coordination.
The photonic ICs are produced using materials like Indium Phosphide, Lithium Niobate, and Gallium Arsenide among others. PICs discover their utilization in transmitters, recipients, tunable lasers, waveguides, and modulated lasers, among others. Photonic ICs are used in optical communication, sensing, optical signal processing, and biophotonicsamong others. They are widely used in different industries including telecom networks, information transmission, high-speed computing, and internet connections.
The different properties such as little size, low-power utilization, higher effectiveness, and scalable functionality are driving the market growth. The PICs have been the reasonable substitution for electronics in various systems and devices that need ideal execution and scaling down. The prevalent highlights of these ICs have prompted their incorporation in cell phones, PCs, and other mobile devices and peripherals which thus is expected to expand its adoption in the buyer electronics section. Implanted computing capacities, a significant degree of incorporated functionalities, low weight, power productivity, and hyper-scale execution are relied upon to fuel the interest for photonic ICs.
Network service providers and data center, telecom, high-speed Internet, and cloud service providers, just as computerization and instrumentation solutions providers are required to be the great recipients of the PIC business progressions. Increased degree of integration and usefulness-In electronic ICs are boosting the market growth.
Based on the integration type, the market is explained and studied into Monolithic Integration, Module Integration,and Hybrid Integration among others. The monolithic integration type occupies a decent share in the market. The hybrid segment will grow at a fast pace between 2021-2026. The hybrid type is used for the integration of medium and large-scale PICs. The major manufacturers in the photonic integrated circuits (PIC) market are involved in developing hybrid integrations. Monolithic integration types are used to fulfill the demands in quantum applications. Thus, organizations are enhancing hybrid platforms that consolidate distinctive photonic technologies inside a solitary functional unit to beat the deficiencies of monolithic photonic circuits.
Based on the raw materials, the market can be considered intoIndium Phosphide, Silicon, Gallium Arsenide, and Lithium Niobate, among others. The Indium Phosphide (InP) section holds the major piece in the market and will continue the trend between 2021-2026. The growing demand for high information speed transmission is boosting the segment growth.
The silicon-on-insulator segment will grow at a high pace because the organizations operating in the photonic integrated circuits (PIC) market are gaining profit from the SOI innovation.
With the growth of cutting-edge data solutions, silicone-based PICs are acquiring popularity around the world. Silicon-PICs can be effortlessly made in the current electronic IC assembling plants with slight changes.
Based on the components of PIC, the market can be segmented into Attenuators, Lasers, Optical Amplifiers, Modulators, Multiplexers /De-multiplexers.The laser component section held the biggest share in the photonic integrated circuit market, attributable to its broad use in engraving, welding, cutting, marking, and drilling. The MUX/DEMUX component segment held the next position in the market. The broad utilization of fiber optics in communication is required to support the portion of PIC in further time with optical amplifiers driving the route in the most noteworthy development.
Based onapplication, the PIC market can be divided into Optical Communication, Biophotonics, Sensing, and Optical Signal Processing.Optical communication ruled the PIC industry divided based on applications. The passed by years have seen an enormous expansion in the data traffic which the conventional copper-based electronic mediums neglect to convey. PIC-based optical communication gives a cost-friendly and productive option in data transmissionwhich is expected to drive the segment development in the coming years. The optical signal processing section is assessed to develop at a quick rate over the predicted time frame, attributable to the developing adoption of PICs in optical amplifiers, lasers, and multiplexers.
The North American region held the major market share of the worldwide business. Expanding the adoption of PICs in communications and detecting applications and the need to update present/current infrastructure is driving the business development in the area. Asia Pacific region is anticipated to exhibit a solid development as the area encounters a significant spike in data centers, long stretch and transport networks, and the energy and utility industry. It is assessed to acquire a generous share in the market over the predicted time frame attributable to expanding demand from the information technology industry in economies like China and India.
Agilent Technologies, VLC Photonics S.L, Broadcom, Uniphase Inc., Ciena Corporation, TE Connectivity, Enablence, Oclaro, Inc., II-VI Inc., NeoPhotonics Corporation, Hewlett Packard, Mellanox Technologies, Huawei Technologies Co., Ltd., MACOM, Infinera Corporation, Cisco Systems, Inc, Intel Corporation, and Broadex Technologies, Co., Ltd. are the major players sharing maximum revenue in the market.
Please note: This is not an exhaustive list of companies profiled in the report.
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The Photonic Integrated Circuits [PIC] Market has been studied from the year 2019 till 2026. However, the CAGR provided in the report is from the year 2021 to 2026. The research methodology involved three stages: Desk research, Primary research, and Analysis & Output from the entire research process.
The desk research involved a robust background study which meant referring to paid and unpaid databases to understand the market dynamics; mapping contracts from press releases; identifying the key players in the market, studying their product portfolio, competition level, annual reports/SEC filings & investor presentations; and learning the demand and supply-side analysis for the Photonic Integrated Circuits [PIC] Market.
The primary research activity included telephonic conversations with more than 50 tier 1 industry consultants, distributors, and end-use product manufacturers.
Finally, based on the above thorough research process, an in-depth analysis was carried out considering the following aspects: market attractiveness, current & future market trends, market share analysis, SWOT analysis of the company and customer analytics.
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