Radiation-Hardened Electronics Market Size, Trends & Analysis - Forecasts to 2026 By Type of Component (Analog & Digital Mixed Signal Devices, Memory, Controllers & Processors, and Power Management Component), By Type of Product (Custom-made and Commercial-Off-The-Shelf [COTS]), By Type of Application (Space, Aerospace & Defense, Nuclear Power Plants, Medical, and Others), By Type of Region (NA [North America], Europe, APAC [Asia Pacific], MEA [the Middle East & Africa], and CSA [Central & South America]), End-User Landscape, Vendor Landscape, Company Market Share Analysis & Competitor Analysis
The radiation-hardened electronics market is denoted to portray a sumptuous improvement of 3.5% during the forecast period (2020-2026). The devices or systems used to shield the effect of ionizing radiation on various electronic and semiconductor elements are called radiation-hardened electronics. The application of radiation-hardened electronics is used in verticals like space, Defense, and automotive. The scope of the market is to increase and improve the surveillance, intelligence, and reconnaissance (SIR) operations. COVID19 has seen a drastic impact on the functioning of the market. Instantaneous consequences were observed in the imports of radiation-hardened electronics from the US as Europe and North America are the key shippers of semiconductor elements. Supply imbalance resulted in the result of the negative expansion of CAGR in the industry. Development for nuclear weaponry, the need for nuclear power plants for power generation, and an increase in demand for electronics systems that withstand radiation are some of the accelerators of the market.
Analog & digital mixed-signal devices, memory, controllers & processors, and power management components are sorts of components in the radiation-hardened electronics market. The segment projected to dominate in the forecast period is the power management component. power switches and power MOSFETs are a few of the power management components in the industry and hold nearly 40% share of the global market. The utilization of the component can be seen in verticals like aerospace and Defense. An increase in the use of transistors, the rise in installations of nuclear plants, and FPGA advancements are some of the drivers influencing the escalation of the market.
Based on the type, custom-made and commercial-off-the-shelf (COTS) are the market categorization of the global market. The COTS segment is witnessed to be the fastest-growing segment in the forecast period. Inflation in end users, a rise in demand for diodes, and an increase in demand for electronic components are the factors assisting the extension of the global market.
The market segmentation based on application is space, aerospace & defense, nuclear power plants, medical, and others. Space application to own the largest share in the CAGR for the forecast period. An increase in space missions, government initiatives, and the incorporation of private companies for space expeditions are some of the major drivers spurring the increment of the market.
Based on the geographical analysis, North America has been the leading region for the precedent years yet, the Asia Pacific region including nations such as China, India, Singapore is heeded to propel in exalted progress during the global market. The rise in investments towards research & developments, an increase in electronic manufacturing companies, and a rise in demand for communication satellites are some of the few propellors of the burgeoning market.
Micropac Industries, The Boeing Company, Anaren Inc., TT Electronics PLC, Data Device Corporation, Solid State Devices, Bae Systems, Microchip Technology, STMicroelectronics, Renesas Electronics, Honeywell Aerospace & Defense, Infineon Technologies, Xilinx Inc., Texas Instruments, Maxwell Technologies, Analog Devices, PSemi Corporation, Teledyne E2V Semiconductors, 3D Plus, Cobham Ltd., and other industries are the dominant players in the global radiation-hardened electronics market.
Please note: This is not an exhaustive list of companies profiled in the report.
In August 2020, BAE Systems proclaimed the intention to extend its operations in Austin, Texas.
In December 2019, STMicroelectronics declared the closing of the complete possession of Swedish silicon carbide (SiC) wafer manufacturer Norstel AB.
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The Global Radiation-Hardened Electronics Market has been studied from the year 2017 till 2026. However, the CAGR provided in the report is from the year 2018 to 2026. The research methodology involved three stages: Desk research, Primary research, and Analysis & Output from the entire research process.
The desk research involved a robust background study which meant referring to paid and unpaid databases to understand the market dynamics; mapping contracts from press releases; identifying the key players in the market, studying their product portfolio, competition level, annual reports/SEC filings & investor presentations; and learning the demand and supply side analysis for the Radiation-Hardened Electronics Market.
The primary research activity included telephonic conversations with more than 50 tier 1 industry consultants, distributors, and end-use product manufacturers.
Finally, based on the above thorough research process, an in-depth analysis was carried out considering the following aspects: market attractiveness, current & future market trends, market share analysis, SWOT analysis of the companies and customer analytics.
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